发明名称 STAMPER HOLDING MECHANISM OF RESIN MOLDING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a stamper holding mechanism, which certainly attaches the stamper in a resin molding apparatus to a mirror surface plate, at low cost. SOLUTION: The resin molding apparatus 11, which is equipped with the stamper 4 for applying unevenness to a resin material 3, has the air permeable member 6 attached to the surface of the fixed mirror surface plate 1 to arrange the outer peripheral end part of the stamper 4 on the upper surface of the mirror surface plate 1 and a cover frame 10 for covering the air permeable member 6 and the outer peripheral end part of the stamper 4. The resin molding apparatus further has the positioning member 5, which is fixed to the upper surface of the air permeable member 6 so as to come into contact with the outer peripheral end part of the stamper 4, and the air passing pipe 7 provided so as to be adjacent to the air permeable member 6. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007136691(A) 申请公布日期 2007.06.07
申请号 JP20050329552 申请日期 2005.11.15
申请人 MEIKI CO LTD 发明人 YOSHIKAWA ISAO;ONGA EIJI
分类号 B29C33/10;B29C33/12;B29C45/34 主分类号 B29C33/10
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