| 摘要 |
A ground-signal-ground (GSG) test structure for production measurement of RF device performance in integrated circuits comprises one pair of signal pads (S 1 , S 2 ) and two pairs of ground pads (G 1 a, G 1 b; G 2 a, G 2 b). All the six pads (G 1 a, G 2 a, S 1 , S 2 , G 1 b, G 2 b) are arranged linearly, whereby the width of the structure is small enough for the structure to be placed in a narrow saw lane of a wafer.
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