Compliant biocompatible packaging scheme based on NiTi shape memory alloys for implantable biomedical microsystems

摘要

A compliant biocompatible packaging scheme, (i.e., coating) for implantable medical device, particularly implantable biomedical microsystems is provided. In accordance with the present invention, the compliant biocompatible coating includes an optional dielectric undercoating and an overcoat comprising a NiTi shape memory alloy.