| 摘要 |
<P>PROBLEM TO BE SOLVED: To compare/determine alignment marks of a process substrate and an exposure mask after completing alignment when foreign matter or the like adheres on the alignment marks of the exposure mask and the process substrate. <P>SOLUTION: An exposure apparatus is equipped with a light source unit 10, a mask holding frame 20, a stage 30, an imaging means 40 to read an alignment mark, an image processing means 50 to process the image of the read alignment mark, a control means 60 to control on/off states of the light source and movement of the stage, a comparing/determination means 70 to compare/determine the alignment mark shape. After the process substrate and the exposure mask are aligned, the comparing/determination means 70 compares/determines the alignment mark shapes on the process substrate and the exposure mask with respect to preregistered alignment mark shapes of the process substrate and the exposure mask. <P>COPYRIGHT: (C)2007,JPO&INPIT |
