发明名称 MULTILAYER SUBSTRATE FOR HIGH-SPEED DIFFERENTIAL SIGNALS, COMMUNICATION EQUIPMENT, AND DATA STORAGE EQUIPMENT
摘要 <p><P>PROBLEM TO BE SOLVED: To solve a problem that, when high speed differential signals are transmitted to a differential interconnection, in the case of interposing a via-hole having an open stab, a waveform distortion arises by impedance mismatch in the open stab causing jitter to be generated. <P>SOLUTION: To the differential interconnection passing through the via-hole having the open stab, the degree of coupling is made small with the differential characteristic impedance kept constant. Consequently, since the impact of the backward crosstalk noise caused by the coupling can be suppressed small, the jitter can be suppressed. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007142307(A) 申请公布日期 2007.06.07
申请号 JP20050336725 申请日期 2005.11.22
申请人 HITACHI LTD 发明人 OSAKA HIDEKI
分类号 H05K3/46 主分类号 H05K3/46
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