| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To realize an apparatus and a method of manufacturing semiconductor chips which can improve the yield of the semiconductor chips to be acquired by separating a semiconductor substrate. <P>SOLUTION: The semiconductor chip manufacturing apparatus 1 includes an adsorbing member 43 for adsorbing and holding a semiconductor chip 22c, and a transfer mechanism 44 for transferring the adsorbing member 43. When the semiconductor chip 22c is adsorbed by the adsorbing member 43 and ascended by the transferring mechanism 44, a shearing stress is generated intensively on a modifying region introduced by irradiation of a laser beam in response to a separation schedule line DL of the semiconductor chip 22c. In this way, the semiconductor substrate 21 is separated in a thickness direction along the separation schedule line DL, and the semiconductor chip 22c can be acquired. The semiconductor chip 22c is transferred by the transfer mechanism 44 in a state where it is adsorbed by the adsorbing member 43 to a mounting process for mounting it on a package. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
