A substantially lead-free solder, comprising: from around 96.8% to around 99.3% tin; from around 0.2 % to around 3.0% copper; and from around 0.02% to around 0.12% silicon.
申请公布号
US2007125834(A1)
申请公布日期
2007.06.07
申请号
US20070674075
申请日期
2007.02.12
申请人
SINGAPORE ASAHI CHEMICAL & SOLDER INDUSTRIES PTE.LTD.
