| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining device capable of forming a reformed layer at an arbitrary position in an object to be machined. <P>SOLUTION: In the laser beam machining device 20, a condenser lens CV1 and a condenser lens CV2 capable of continuously changing the relative distance by a lens moving mechanism are provided on the optical axis Lo of laser beams L to be emitted from a laser beam source toward a wafer W. The condensed point forming position of the laser beams L" condensed by the condenser lens CV1 and the condenser lens CV2 can be arbitrarily changed, and the forming position of the condensed point Pa (relatively shallow position) and the condensed point Pc (relatively deep position) can be continuously set at arbitrary positions even within the wafer W. Thus, a reformed layer can be formed at arbitrary positions in the wafer W, for example, at the relatively shallow position Pa, a substantially intermediate position Pb and the relatively deep position Pc. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
