发明名称 LASER BEAM MACHINING DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining device capable of forming a reformed layer at an arbitrary position in an object to be machined. <P>SOLUTION: The laser beam machining device 20 comprises a laser beam source capable of generating laser beams L of the predetermined wavelength, optical fibers FB1 provided capable of conducting the laser beams L generated from the laser beam source and emitting the laser beams L' toward a wafer W from a fore-end Ft1 formed in a tapered manner toward a fore-end t1, and an optical fiber tip moving mechanism capable of continuously changing the distance D1 between the tip t1 of the optical fibers FB1 and the wafer W. The laser beams L' emitted from the tapered tip t1 are condensed by the tip part Ft1 to form a condensed point Pa at the predetermined position Dp1. By continuously changing the distance D1 between the tip t1 and the wafer W by the optical fiber tip moving mechanism, the forming positions of the condensed points Pa, Pb, Pc can be continuously set at arbitrary positions even within the wafer W. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007136483(A) 申请公布日期 2007.06.07
申请号 JP20050331224 申请日期 2005.11.16
申请人 DENSO CORP 发明人 KOMURA ATSUSHI;FUJII TETSUO
分类号 B23K26/04;B23K26/08;B23K26/38;B23K26/40;B23K101/40 主分类号 B23K26/04
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