| 摘要 |
PROBLEM TO BE SOLVED: To provide a die attach paste for a semiconductor exhibiting low modulus of elasticity and good adhesiveness and to provide a semiconductor device having excellent reliability of especially reflow resistance, etc. SOLUTION: A resin composition comprises an acrylic or a methacrylic ester compound (A) having a carboxy group, a compound (B) which has an allyl or a methallyl ester group and is a liquid at room temperature, a heat radical polymerization initiator (C) and a filler (D). The semiconductor device is prepared by using the resin composition as the die attach paste or a material for bonding heat radiating members. COPYRIGHT: (C)2007,JPO&INPIT
|
