STRUCTURE FOR PACKAGING DEVICE WITHIN LAMINATED BOARD, AND LAMINATED BOARD AND DEVICE MODULE USED THEREUNTO

摘要

A structure for packaging a device within a laminated board, and a laminated board and a device module used thereto are provided to reduce a production cost and to minimize a size by using epoxy or soldering without an additional flip chip or wire bonding. A structure for packaging a device within a laminated board includes cavities(4) formed in a communication module(1) and an active and passive device module(6) to prevent a leakage current by being shielded by a plurality of ground vias(3) and connect the communication module(1) and the active and passive device module(6). The cavity(4) includes input/output ports(7,8) to transmit a signal through a coupling. The communication module(1) and the active and passive device module(6) are arranged accurately outside the cavity(4) through a predetermined bonding device.