EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

Semiconductor photo spinner equipment is provided to reduce a time required for measuring a thickness of photoresist formed on a wafer which is rotated by a spin chuck in real time. A spin coater applies photoresist onto a waver, and a baking unit bakes the photoresist applied on the spin coater. A wafer edge exposing unit has a spin chuck(214) rotating the wafer with the photoresist baked by the baking unit, and an exposing part(212) exposing an edge of the wafer rotated by the spin chuck. A thickness measuring unit(270) is provided on one side of the wafer edge exposing unit to measure a thickness of the photoresist formed on the water rotated by the spin chuck.