| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board by which a small circuit board is obtained. SOLUTION: The method of manufacturing the circuit board removes a dam 9 after forming an underfill 7, so that the dam 9 does not exist after manufacturing the circuit board. Thus, on the surface of an insulation board 1 where the dam 9 is positioned conventionally, a land 2b, a cover 8 etc. can be arranged, so that the surface of an insulation board 1 where the dam 9 is positioned conventionally is utilized effectively, and the small circuit board is obtained. COPYRIGHT: (C)2007,JPO&INPIT
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