| 摘要 |
[PROBLEMS] To provide a multilayer printed wiring board wherein reliabilities are improved and electrical connection and electrical functions are ensured, especially a reliability in a drop test is improved. [MEANS FOR SOLVING PROBLEMS] A solder pad (60B) whereupon a component is mounted is not provided with an anticorrosion layer and has flexibility. Therefore, even the solder pad is dropped and receives a shock, the shock can be buffered and the mounted component is not easily dropped. On the other hand, a land (60A) whereupon an anticorrosion layer is formed does not easily cause a contact failure, even when carbon columns configuring operation keys are repeatedly brought into contact. |
