| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device having a flip-chip connected semiconductor chip. <P>SOLUTION: A semiconductor chip 10 to be flip-chip mounted includes gold stud bumps 16 on the main surface 12 thereof where a semiconductor integrated circuit is formed. The stud bumps 16 contain silver (Ag). The content of silver is preferably 17%±2%. The gold stud bumps 16 are connected to Cu electrodes 22 in the substrate 20 via solder bumps 24. The inclusion of silver into the gold stud bumps 16 enables reducing the occurrence of voids and cracks during the bonding of the gold stud bumps 16 and Cu electrodes 22. <P>COPYRIGHT: (C)2007,JPO&INPIT |
