发明名称 DEVICE OF PROCESSING SEMICONDUCTOR WAFER
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a device of processing a semiconductor wafer capable of easily mounting a UV irradiation unit. <P>SOLUTION: The device is provided with a cassette loading stand 35 that loads a cassette 10 for accommodating a semiconductor wafer supported through a support frame with a protective tape, a processing means 7 that processes the semiconductor wafer transported into a processing region, and a transporting means 5 that transports the semiconductor wafer W between the cassette 10 and the processing region. Here, a wafer bringing-in/out mechanism that loads the semiconductor wafer and brings in/out the loaded semiconductor wafer into/from the transporting means side and the UV irradiation unit that loads the brought-in semiconductor wafer from the transporting means side and irradiates ultraviolet rays to the protective tape to which the semiconductor wafer is affixed are selectively and detachably disposed inside the stand 35. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007142327(A) 申请公布日期 2007.06.07
申请号 JP20050337200 申请日期 2005.11.22
申请人 DISCO ABRASIVE SYST LTD 发明人 INOUE TAKAAKI;HIGAKI TAKEHIKO
分类号 H01L21/677;H01L21/301 主分类号 H01L21/677
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