| 发明名称 |
BISIMIDE OR BISISOIMIDE COMPOUND AND RESIN COMPOSITION COMPRISING THE SAME |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition suitable for interlayer insulation of a multi-layered flexible printed circuit board exhibiting excellent workability and adhesion before curing and exhibiting excellent heat resistance, adhesion and electrical performance after curing. SOLUTION: The resin composition comprises a polyimide or a polyamic acid and a bisimide or a bisisoimide compound represented by formula (1). (One of the A and B is = O and the other of the A and B is = NAr<SP>1</SP>R<SP>1</SP>; R<SP>1</SP>, R<SP>2</SP>, Ar<SP>1</SP>, X<SP>1</SP>and X<SP>2</SP>are each a specific organic group). COPYRIGHT: (C)2007,JPO&INPIT |
| 申请公布号 |
JP2007137960(A) |
申请公布日期 |
2007.06.07 |
| 申请号 |
JP20050331163 |
申请日期 |
2005.11.16 |
| 申请人 |
AMT KENKYUSHO:KK;MANAC INC |
发明人 |
WATANABE TAKASHI;NAKAJIMA KENJI;TANAKA KEIZO;NANBA SATORU |
| 分类号 |
C08L79/08;B32B15/088;C08G73/10;C08K5/3415;H05K1/03 |
主分类号 |
C08L79/08 |
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