发明名称 CHIP TYPE ELECTRONIC COMPONENT STORING MOUNT
摘要 PROBLEM TO BE SOLVED: To provide a chip type electronic component storing mount which has no trouble caused by static electricity when a cover tape is released, and in addition, can be used in a clean room as there exist extremely few troubles caused by paper powder. SOLUTION: The chip type electronic component storing mount is composed by comprising both an electrically-conductive fiber with a mean curl factor C defined by the formula: C=L1/L2 (wherein, C denotes curl factor, L1 denotes fiber length, and L2 denotes fiber-end distance), in a range of 1.05-1.55, and a resin emulsion selected from an acrylate copolymer, acrylonitrile-butadiene copolymer (NBR), styrene-butadiene copolymer (SBR), polyurethane resin, polyester resin, polyvinyl acetate and ethylene-vinyl acetate copolymer (EVA). The surface electric resistance of the paper under an environmental condition of 23°C and 50% RH is≤1×10<SP>9</SP>Ω. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007137436(A) 申请公布日期 2007.06.07
申请号 JP20050330256 申请日期 2005.11.15
申请人 OJI PAPER CO LTD 发明人 OKUYA TAKEHITO;SUENAGA HIROSHI
分类号 B65D85/86;B65D65/42;B65D73/02;D21H21/14 主分类号 B65D85/86
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