| 摘要 |
Embodiments of the invention provide new fittings and fitting assemblies for tight, leak-proof filter and fluid connections in a pump useful in dispensing fluid onto wafers during a semiconductor manufacturing process. One embodiment of a fitting assembly comprises an o-ring-less low profile fitting and a low profile male threaded locking nut. A manifold of the pump is machined with a female threaded hole for receiving the fitting and the locking nut. The fitting has higher compressibility than the manifold. Initially, as one end of the fitting touches the bottom of the receiving hole, there is a small gap between the end of the fitting and the bottom of the receiving hole. As the fitting is pressed down, the end of the fitting that touches the bottom of the receiving hole begins to deform and fill the small gap, thus creating a tight seal between the fitting and the manifold.
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