Heat transfer structure for electronic devices

摘要

A heat transfer structure for electronic devices comprises at least two electronic devices coupled with corresponding heat adaptors, a high heat conductivity plate and at least two heat pipes spaced between the plate and the heat adaptors. Each of heat pipes comprises an adiabatic section located between evaporating and condensing sections. Each of heat adaptors from one side is in a tight contact with the electronic device while the other side is thermally connected with the evaporating section of at least one of heat pipes. The adiabatic section is made like a bend with at least one curvature radius, thus serves like a displacement compensator. The condensing section of each heat pipes is thermally connected with the plate.