发明名称 ELECTRONICS MODULE ASSEMBLY
摘要 An electronics module assembly for detachably retaining a pair of electronic sub-modules in a single slot of a chassis. A host module of the electronics module assembly is configured to be detachably received and retained in a slot of the chassis. The host module has a height corresponding with a height of the slot of the chassis. A pair of sub-modules are configured to be detachably received and retained in the host module. The combined height of the sub-modules is no greater than the height dimension of the slot of the chassis. Therefore, where there was once only room for one electronics module in a single slot of the chassis, a pair of sub-modules with the host module may now be utilized in the single slot of the chassis.
申请公布号 WO2006122248(A3) 申请公布日期 2007.06.07
申请号 WO2006US18249 申请日期 2006.05.10
申请人 SCIENTIFIC-ATLANTA, INC.;SANDGREN, DANIEL, J.;CLARK, JOSEPH, R. 发明人 SANDGREN, DANIEL, J.;CLARK, JOSEPH, R.
分类号 G02B6/44;H05K7/14 主分类号 G02B6/44
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