| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly adhesive polyimide film which shows an improved adhesion to a copper foil and is excellent in dimensional stability and water wettability, and a method for manufacturing the same. SOLUTION: The highly adhesive polyimide film is a polyimide film formed from 3,4'-diaminodiphenyl ether, 4,4'-diaminodiphenyl ether and pyromellitic dianhydride. The heat shrinkage rates of the film at 200°C in the machine-conveying direction (MD) and the width direction (TD) are both≤0.05%, the surface roughness Ra and Rmax of the film surface measured by a stylus profilometer are≥0.060μm and≥1.0μm, respectively, and the surface free energy measured based on the contact angle is≥75 mN/m. COPYRIGHT: (C)2007,JPO&INPIT
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