发明名称 Electroplated abrasive tools, methods, and molds
摘要 The present invention provides for a mold that can position and hold abrasive particles, which are to be electrolytically attached to an electrically conductive substrate during an electrolytic process. The mold can include an insulating material with a molding surface suitable for holding the abrasive particles in place during this process. Additionally, a method for making an abrasive tool using such a mold is provided, as well as abrasive tools made thereby. In one aspect of this invention, abrasive tools can have abrasive particle tips that are arranged in accordance with a predetermined vertical pattern and/or a predetermined horizontal pattern in a manner that requires little or no post electrodeposition processing.
申请公布号 US2007128994(A1) 申请公布日期 2007.06.07
申请号 US20050292938 申请日期 2005.12.02
申请人 SUNG CHIEN-MIN 发明人 SUNG CHIEN-MIN
分类号 B24B7/16 主分类号 B24B7/16
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