| 摘要 |
A test socket for a semiconductor package is provided to smoothly contact a contact terminal of the semiconductor package with a contact pin of the test socket and prevent impact from being provided to an internal chip because a load is concentrated in one part of the semiconductor package by pressurizing the semiconductor package and uniformly dispersing the pressure to the semiconductor package. A semiconductor package(50) is laid on a base(52). A contact pin(56) is installed in the base(52) to correspond to a contact terminal(54) of the semiconductor package(50). A cover(58) is installed in an upper side of the base(52). A pressure part(70) pressurizes the semiconductor package(50) so that the contact terminal(54) of the semiconductor package closely adheres to the contact pin(56) when the cover(58) is closed, and simultaneously disperses the pressure to the semiconductor package(50).
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