发明名称 PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma processing device capable of executing a process with high reliability, and a plasma processing method. <P>SOLUTION: The plasma processing device generates discharge plasma by impressing alternating electric field between paired electrodes under atmospheric pressure or neighborhood thereof, and makes the excited gas generated in the plasma act on a base material to be processed by blowing the excited gas thereon. First and second passages for exciting main discharge gas composed of rare gas, blowing the excited main discharge gas, and a control means for controlling a state of oxygen in a space located between a gas blow out part of the first passage and that of the second passage, are provided. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007141644(A) 申请公布日期 2007.06.07
申请号 JP20050333814 申请日期 2005.11.18
申请人 IWASAKI ELECTRIC CO LTD 发明人 MATSUMOTO HIROYUKI;SUGANO TOSHIYA;IMAMURA YOSHIO
分类号 H05H1/24;B08B7/00;H01L21/304 主分类号 H05H1/24
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