发明名称 MOLD HAVING DIAMOND-LIKE CARBON COMPOSITE LAYERS
摘要 <P>PROBLEM TO BE SOLVED: To provide a mold having relatively high bonding force between diamond-like carbon composite layers and a substrate. <P>SOLUTION: This invention relates to a mold having diamond-like carbon composite layers where the diamond-like carbon composite layers are composed such that a first layer through to (N+1)th layer are sequentially provided from the substrate to the outer surface, and the first layer through to Nth layer are each a diamond-like carbon layer including a filler being a metal or a metal nitride where mole percent of the filler in each layer gradually decreases toward the surface, and the (N+1)th layer consists of a pure diamond-like carbon layer. The value of N is 2-30. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007137066(A) 申请公布日期 2007.06.07
申请号 JP20060313356 申请日期 2006.11.20
申请人 KOFUKIN SEIMITSU KOGYO (SHENZHEN) YUGENKOSHI;HON HAI PRECISION INDUSTRY CO LTD 发明人 CHIN KETSURYO
分类号 B29C33/38;C01B31/02;C23C14/06;C23C28/00 主分类号 B29C33/38
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