| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent faulty connections among chips and a wiring substrate due to the concentration of stress, by enlarging the sectional areas of bumps, going from the center toward the outer periphery of a region with a plurality of bumps arranged thereon. <P>SOLUTION: The bumps between the chip 2 and the wiring substrate are arranged annularly to disperse the stress generated in the outer periphery of the chip 2, and the bumps having different diameters are arranged from the center toward the outer periphery of the chip. The diameter of the bumps 3c, at positions having maximal distance from the center of the chip 2, is larger than that of the bumps 3a, at positions having minimal distance from the center of the chip; while the diameter of the bumps 3b at intermediate positions is larger than that of the bumps 3a and smaller than that of the bumps 3c. According to this constitution, improvement in reliability can be realized regarding the jointing of the semiconductor device. <P>COPYRIGHT: (C)2007,JPO&INPIT |
