| 摘要 |
PROBLEM TO BE SOLVED: To perform high-quality soldering using a solder flow system upon a circuit board whereon a circuit board-through component is mounted. SOLUTION: A flow palette that is conveyed by a solder flow apparatus comprises a placing plate on which a circuit board can be placed at an arbitrary angle with respect to to a conveying direction. In accordance with the arrangement of a lead of a component inserted and mounted through the circuit board, the angle of the placing plate with respect to the conveying direction is set to an angle at which a bridge is most hardly formed by a fused solder, and soldering using the flow system is then performed upon the circuit board on the placing plate. Thus, the generation of a bridge between leads of components can be effectively suppressed and high-quality soldering can be performed on the circuit board. COPYRIGHT: (C)2007,JPO&INPIT |
