| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method thereof which suppresses the progression of the exfoliation of its sealing layer in the terminal of its conductive layer. <P>SOLUTION: The semiconductor device has a semiconductor substrate 2 having an electrode 3, an insulating resin layer 4 formed on the semiconductor substrate 2 and having an opening 4a in the position corresponding to the electrode 3, a metal wiring layer 5 formed on the insulating resin layer 4 and connected electrically with the electrode 3 exposed to it from the opening 4a of the insulating resin layer 4, a sealing resin layer 6 formed on the metal wiring layer 5 and having an opening 6a in the position corresponding to the metal terminal 5b of the metal wiring layer 5, and a solder bump 7 formed on the metal terminal 5b exposed to it from an opening 6a of the sealing resin layer 6. Hereupon, there is provided a groove 8 in the region positioned in the periphery of at least the opening 6a which is present in the covered portion of the metal terminal 5b, with the sealing resin layer 6 to fill a portion of the sealing resin layer 6 in the groove 8. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
