| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a mounting substrate of good reliability in flip chip mounting a semiconductor chip, and to provide a semiconductor device where the semiconductor chip is mounted on the mounting substrate. <P>SOLUTION: The mounting substrate for flip chip mounting the semiconductor chip comprises a plurality of connection pads to which the semiconductor chip is connected, an insulating pattern that is formed to cover a part of the connection part, and a plurality of dummy patterns for controlling the flow of an underfill infiltrating under the semiconductor chip. The plurality of dummy patterns are arranged staggered in grid. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
