发明名称 |
Semiconductor package structure and method for separating package of wafer level package |
摘要 |
The present invention provides a separating process of a semiconductor device package of wafer level package. The method comprises a step of etching a substrate to form recesses. Then a buffer layer is formed on the first surface of the substrate, wherein the buffer layer is filled with the corresponding recesses to form infillings on adjacent the semiconductor device package. Dicing the wafer into individual package along substantial center of said infillings, the step may avoid the roughness on the edge of each die and also decrease the cost of the separating process. |
申请公布号 |
US2007128835(A1) |
申请公布日期 |
2007.06.07 |
申请号 |
US20050293104 |
申请日期 |
2005.12.05 |
申请人 |
ADVANCED CHIP ENGINEERING TECHNOLOGY INC. |
发明人 |
YANG WEN-KUN;CHANG JUI-HSIEN |
分类号 |
H01L21/00;H01L21/4763 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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