| 摘要 |
A light emitting device is provided to effectively transmit and radiate the heat generated form the device by forming a heat radiating portion which penetrates a substrate and is thermally and electrically connected to a lead pattern. Heat radiating portions(102a,102b) penetrate a substrate(100), and a pair of lead patterns(104a,104b) are spaced apart from each other on the substrate. A light emitting chip(120) is mounted on at least one of the lead pattern. The lead pattern is formed to cover an upper end of the heat radiating patterns, and is thermally and electrically connected to the heat radiating portions. The heat radiating portion contains Cu or Al.
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