| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a tape wiring substrate in which the disconnection of an inner lead is suppressed by reducing a stress concentration to the inner lead when joining an electrode pad of a semiconductor chip with a bump electrode, its manufacturing method, and a semiconductor device. <P>SOLUTION: The tape wiring substrate is provided with a flexible insulating base material 1, a plurality sets of conductor wiring provided on the insulating base material and forming each inner lead 2 by each end alignedly arranged in a region 4 to which the semiconductor chip is mounted, and the bump electrode 3 provided to each inner lead. The substrate is composed so that the semiconductor chip can be mounted by face-down bonding by joining each electrode pad of the semiconductor chip with each bump electrode. Each length of the bump electrodes 3a-3c formed in each of a plurality of the inner leads arranged at a row end in each aligned inner lead is gradually elongated corresponding to a position of the inner lead from the inside inner lead to the inner lead at the endmost row. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
