| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum micorpackage preventing thermal insulation defects, and to provide a method of manufacturing the same. SOLUTION: The vacuum micro package comprises an elopement-side substrate 1, a window-side substrate 3, and a solder 2 of a jointing member. The element-side substrate 1 mounts a detector 20, on which a conductive layer is formed. The window-side substrate 3 is arranged facing the element-side substrate 1 so that the space, in which the detector 20 is arranged, is made at a vacuum to cover the detector 20, and is connected to the element-side substrate 1 by the solder 2 so as to surround the detector 20. A conductive film (anti-reflection film 9a) is arranged on a surface 3a, facing the element-side substrate 1 in the window-side substrate 3. In the conductive layer (wiring 10) of the element-side substrate 1 and the window-side substrate 3, by electrically connecting the element-side substrate 1 and the conductive film (anti-reflection film 9a), arranged on the surface 3a facing the substrate 1, the connection makes the substrate potential of the element-side substrate 1 equipotential with the substrate potential of the window-side substrate 3. COPYRIGHT: (C)2007,JPO&INPIT
|
