PRINTED CIRCUIT BOARD USING PASTE BUMP AND METHOD OF MANUFACTURING SAME

摘要

PROBLEM TO BE SOLVED: To disclose a printed circuit board using a paste bump and a method of manufacturing the same. SOLUTION: The method of manufacturing the printed circuit board using a paste bump comprises: (a) a step of forming a via hole by perforating a core substrate; (b) a step of filling the via hole with fill plating and forming a circuit pattern on the surface of the core substrate; (c) a step of stacking paste bump substrates on the surface of the core substrate; and (d) a step of forming an outer layer circuit on the surface of the paste bump substrate. The method can permit embodiment of an any layer IVH structure that is structurally stable according to an increase in the strength of the BVH of the plated core substrate, and reduce manufacturing time due to parallel processes and simultaneous stacking. Moreover, the copper foil sheet of the paste bump substrate that is stacked on the outermost layer facilitates the embodiment of a fine circuit, and the omission of a part of plating and drilling steps reduces the manufacturing cost. The interlayer connection area of the circuit pattern increases to improve connection reliability, and dimple coverage is permitted. COPYRIGHT: (C)2007,JPO&INPIT