| 摘要 |
PROBLEM TO BE SOLVED: To provide a film forming method for enabling improving internal stress of the film. SOLUTION: In the film forming method, firstly, a substrate 2 is warped in a first direction Z1. Secondly, a film 4 is formed on the warped substrate 2. Thirdly, the warped substrate 2 is warped in a second direction Z2 opposite to the first direction Z1. COPYRIGHT: (C)2007,JPO&INPIT |
