发明名称 CUTTING METHOD FOR GLASS SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To prevent faulty cutting in the cutting of a glass substrate that constitutes a liquid crystal panel. SOLUTION: The cutting method comprises laminating a TFT substrate 10 and a CF substrate 20 via a sealing layer 30, then forming a scribe line S1 composed of median cracks caused by plastic deformation on the surface of the TFT substrate 10 between a sealing layer 30A and a sealing layer 30B that are a part of the sealing layer 30, and defining a first virtual line V1 that corresponds to the scribe line S1 on the surface of the CF substrate 20, further defining a second virtual line V2 between the first virtual line V1 and the sealing layer 30B that is situated far from the first virtual line V1, and breaking the TFT substrate 10 by pressing a tip part 50C of a bar 50 on the second virtual line V2, wherein the median cracks of the scribe line S1 extend as extending cracks without curving toward the direction of the sealing layer 30A. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007137699(A) 申请公布日期 2007.06.07
申请号 JP20050331096 申请日期 2005.11.16
申请人 EPSON IMAGING DEVICES CORP 发明人 FUKUMURA KAZUYA;TOKUNAGA MASAHIKO
分类号 C03B33/037;G02F1/13;G02F1/1333 主分类号 C03B33/037
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