发明名称 |
BONDING METHOD AND METHOD FOR MANUFACTURING DISPLAY DEVICE |
摘要 |
<p>Air bubbles or a foreign material (5) in a bonding portion is surely detected when a transparent board (2) and a board-like body (1) are bonded on the entire planes with a transparent adhesive layer (3). Light is applied to the adhesive layer from a side of the adhesive layer by using an optical fiber (4) and the like, and the status of the transparent adhesive layer (3) is inspected by the light guided through the transparent adhesive layer (3). An inspection discriminated from that for detecting defects of the bonded transparent board (2) can be performed.</p> |
申请公布号 |
WO2007063818(A1) |
申请公布日期 |
2007.06.07 |
申请号 |
WO2006JP323643 |
申请日期 |
2006.11.28 |
申请人 |
SEIKO INSTRUMENTS INC.;MATSUHIRA, TSUTOMU |
发明人 |
MATSUHIRA, TSUTOMU |
分类号 |
G09F9/00;G01N21/958;G02F1/13;G02F1/1333 |
主分类号 |
G09F9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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