发明名称 BONDING METHOD AND METHOD FOR MANUFACTURING DISPLAY DEVICE
摘要 <p>Air bubbles or a foreign material (5) in a bonding portion is surely detected when a transparent board (2) and a board-like body (1) are bonded on the entire planes with a transparent adhesive layer (3). Light is applied to the adhesive layer from a side of the adhesive layer by using an optical fiber (4) and the like, and the status of the transparent adhesive layer (3) is inspected by the light guided through the transparent adhesive layer (3). An inspection discriminated from that for detecting defects of the bonded transparent board (2) can be performed.</p>
申请公布号 WO2007063818(A1) 申请公布日期 2007.06.07
申请号 WO2006JP323643 申请日期 2006.11.28
申请人 SEIKO INSTRUMENTS INC.;MATSUHIRA, TSUTOMU 发明人 MATSUHIRA, TSUTOMU
分类号 G09F9/00;G01N21/958;G02F1/13;G02F1/1333 主分类号 G09F9/00
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