| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a double-face electrode package and its manufacturing method enabled in connection on a surface side and on a rear surface side with ease even without forming a through hole in an LSI chip. <P>SOLUTION: The LSI chip is sealed with a molding resin, and external connection electrodes are provided on both faces of the surface side and on the rear surface side. The LSI chip is bonded to a die pad of a lead frame where an outer lead part is exposed at least on the rear surface side with an outer lead part taken as a rear surface side electrode, wiring is performed between the LSI chip and a plurality of inner leads of the lead frame. On at least one part of the plurality of the inner leads the surface electrode is integrally formed by subjecting a part of the lead frame to drawing processing. The head of the surface electrode or a bump electrode connected to the head is constituted as the external connection electrode for connection with other substrates or elements or the like. <P>COPYRIGHT: (C)2007,JPO&INPIT |
