| 摘要 |
<P>PROBLEM TO BE SOLVED: To acquire a power module for miniaturizing an apparatus and making its loading to a HEV easy. <P>SOLUTION: Semiconductor chips 1a-1c are mounted at predetermined locations on a surface of a terminal plate 40H. Semiconductor chips 2a-2c are mounted at predetermined locations on surfaces of bus bars 11u-11w. Source electrodes S of the semiconductor chips 1a-1c are bonded to back faces of the bus bars 11u-11w by soldering and brazing. Source electrodes S of the semiconductor chips 2a-2c are bonded to a back face of the terminal plate 40L by soldering and brazing. Since a printed board for mounting the semiconductor chips 1a-1c, 2a-2c is not necessary, the apparatus can be entirely miniaturized. <P>COPYRIGHT: (C)2007,JPO&INPIT |
