发明名称 PROBER AND WAFER TEST METHOD
摘要 PROBLEM TO BE SOLVED: To provide a prober capable of accurately setting the temperature of a device to be examined with simple configuration. SOLUTION: In a prober, terminals of testers 21, 22 are connected to electrodes of a plurality of semiconductor devices formed on a wafer W in order to examine the semiconductor devices using the testers. The prober comprises a probe card 18 including a probe 19 for connecting the electrodes to the terminals of the testers in contact with the electrodes of the semiconductor devices, a wafer chuck 11 for holding the wafer, and a dipping liquid source 34 for supplying a dipping liquid DL with electric insulation property and high heat conductivity onto the wafer held by the wafer chuck. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007142246(A) 申请公布日期 2007.06.07
申请号 JP20050335627 申请日期 2005.11.21
申请人 TOKYO SEIMITSU CO LTD 发明人 FUJITA TAICHI;TABAYASHI MASATOSHI;MOTOYAMA TAKASHI;YAMAGUCHI AKIRA;SAKUYAMA SHINICHI
分类号 H01L21/66;G01R31/26 主分类号 H01L21/66
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