发明名称 SOLID-STATE IMAGE PICKUP DEVICE, AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a solid-state image pickup device that is compact, has high sensitivity, and can be produced with improved yields; and to provide a manufacturing method of the solid-state image pickup device. SOLUTION: The solid-state image pickup device comprises a light receiver 2; a microlens 6 formed on the light receiver 2; a first transparent layer 7 formed on the microlens 6; a solid-state image pickup element 20 that is formed on the microlens 6 or at the upper portion of the microlens 6, and has a second transparent layer 8 that is harder than the first transparent layer 7; a transparent member 9 that is provided at the upper portion of the second transparent layer; and an adhesive layer 10 for adhering the second transparent layer 8 to the transparent member 9. The second transparent layer 8 is hard, thus preventing flaws, or the like from entering in a dicing process. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007142207(A) 申请公布日期 2007.06.07
申请号 JP20050334745 申请日期 2005.11.18
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KOMATSU TOMOKO;MASUDA TOMOKI;TERANISHI SHINICHI
分类号 H01L27/14 主分类号 H01L27/14
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