| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component capable of reducing chip destruction and performing a stable operation by reducing stress that a chip receives from an adhesive resin when heating and curing the adhesive resin for fixing the chip inside a cavity. SOLUTION: In side face spaces 16a-16d formed between the cavity side face 18 of a cavity 3 formed on a ceramic substrate 4 and the chip side face 19 of the chip 10 arranged in the cavity 3 and in corner spaces 32a-32d, the adhesive resin 14 for fixing the chip 10 to the cavity 3, and a gap 13 not provided with the adhesive resin 14, are formed. COPYRIGHT: (C)2007,JPO&INPIT
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