发明名称 METHOD FOR MANUFACTURING SUBSTRATE FILLED WITH FILLER
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a substrate filled with a filler for achieving both of precision processing and mass productivity. SOLUTION: The method for manufacturing a substrate filled with a filler having at least one recessed portion on at least one surface and applying energy to the surface protected by a protective film excluding the recessed portion, after the recessed portion is filled with a curable filler, to cure the filler, is provided with a tacky portion between the protective film and the substrate and the tackiness of the tacky portion decreases by the energy. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007140381(A) 申请公布日期 2007.06.07
申请号 JP20050337321 申请日期 2005.11.22
申请人 TOYO INK MFG CO LTD 发明人 KIMURA YASUNORI;DOI KENICHI;MACHIDA TOSHINORI;YAMAGUCHI TAKEO
分类号 G02B5/02 主分类号 G02B5/02
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