摘要 |
<p>The device has a functional layer (40) exhibiting a metallization layer on its surface (41), where the metallization layer is applied selectively on the surface of the functional layer by a galvanic separation process. A substrate material (20) has a main extension layer (21), where the surface of the functional layer runs perpendicular to the main extension layer. The metallization layer has a metal e.g. copper, aluminum, gold, where the metal is resistant against a sacrifice layer etching e.g. hydrogen fluoride etching, chlorine trifluoride etching. An independent claim is also included for a method for manufacturing a micromechanical device.</p> |