发明名称 Fabrication of a wiring pattern and of an active matrix substrate
摘要 A method for fabricating a pattern on a substrate, includes the steps of forming banks (B) according to formation areas of the pattern on the substrate, disposing a first function liquid (X1) between the banks, disposing a second function liquid (X2) on the first function liquid, and applying predetermined treatments to the first and the second function liquids which are disposed between the banks so as to form the pattern with plural materials stacked one on the other.
申请公布号 EP1777581(A3) 申请公布日期 2007.06.06
申请号 EP20060077274 申请日期 2004.05.10
申请人 SEIKO EPSON CORPORATION 发明人 HIRAI, TOSHIMITSU
分类号 G02F1/1343;G02F1/1362;B05D5/12;B05D7/00;G02F1/136;G09F9/00;H01L21/288;H01L21/3205;H01L21/336;H01L21/768;H01L21/77;H01L27/12;H01L27/32;H01L29/786;H01L51/00;H01L51/40;H01L51/50;H05B33/02;H05B33/10;H05K3/12 主分类号 G02F1/1343
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