摘要 |
<p>A camera module (1) having a relatively compact size and adapted to be equipped in camera-equipped electronic apparatuses such as a cellular phone and the like is provided. The camera module (1) includes a lens unit (2) which holds at least one lens (1a, 1b); an image pickup device (5) provided below the lens unit (2), the image pickup device (5) having a bottom surface, and the image pickup device (5) including a substantially planar ground (5a) provided over roughly the entire of the bottom surface thereof; and a substrate (6) provided on the side of the bottom surface of the image pickup device (5), the substrate (6) having an upper surface, and the substrate (5) including a grounding land (6a) having substantially the same shape and size as those of the ground (5a) of the image pickup device (5) and formed so as to have a lattice pattern. The ground (5a) of the image pickup device (5) is bonded to the grounding land (6a) of the substrate (6) via a conductive adhesive so that the ground (5a) of the image pickup device (5) and the grounding land (6a) of the substrate (6) are electrically connected to each other.</p> |