WIRING BOARD AND WIRING BOARD MODULE

摘要

A wiring board module (10) includes a multilayer wiring board (11). On the mounting surface (11a) of the multilayer wiring board (11) are mounted, for example, a crystal oscillator (1) and an IC component (2). On the mounting surface (11a) are formed mounting lands (12) for the IC component (2), mounting lands (13) for the crystal oscillator (1), and mounting lands (14) for other surface mount components. Each mounting land (13) for the crystal oscillator (1) is not a conventional single large-area land but is composed of four adjacent land pieces (13a). The four land pieces (13a) are electrically connected via an external terminal (1a) of the crystal oscillator 1, thereby functioning as a mounting land for the external terminal (1a). In other words, each of the plurality of mounting lands (13) provided at positions corresponding to external terminals (1a) of the crystal oscillator (1) is divided into four land pieces (13a).