发明名称 |
Multichipmodul mit einer mehrzahl Halbleiterchips auf einem Halbleitersubstrat |
摘要 |
Each bare-chip IP includes pad electrodes that are of the same size and shape, made of the same material, and arranged in an array at the same pitch over almost the entire surface thereof. A silicon wiring substrate includes pad electrodes that are arranged in an array over almost the entire surface thereof at the same pitch as that between the pad electrodes of the bare-chip IPs. The bare-chip IPs are mounted on the silicon wiring substrate, thereby making a multichip module. <IMAGE> |
申请公布号 |
DE60128055(D1) |
申请公布日期 |
2007.06.06 |
申请号 |
DE2001628055 |
申请日期 |
2001.12.20 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO. LTD. |
发明人 |
SAKIYAMA, SHIRO;KAJIWARA, JUN;KINOSHITA, MASAYOSHI |
分类号 |
H01L25/065;H01L25/18;H01L25/04;H01L25/07 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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