| 摘要 |
<p>The present invention relates to a metallic laminate for printed-circuit base board composed of two low thermal expansion polyimide resin layers having thermal expansion coefficient of up to 20 ppm/□, a metal conductor layer, and a high thermal expansion polyimide resin layer having thermal expansion coefficient of more than 20 ppm/□ which is loaded on the above low thermal expansion polyimide resin layers, and a preparation method of the same.</p> |
